Setšoantšo ke sa litšupiso, ka kopo ikopanye le rona ho fumana setšoantšo sa 'nete
| Nomoro ea Karolo ea Moetsi: | MSCSM70VM19C3AG |
| Moetsi: | Roving Networks / Microchip Technology |
| Karolo ea Tlhaloso: | PM-MOSFET-SIC-SBD~-SP3F |
| Lipampiri tsa boitsebiso: | MSCSM70VM19C3AG Lipampiri tsa boitsebiso |
| Keta Boemo ba Mahala / Boemo ba RoHS: | Lead Free / RoHS e tsamaellana |
| Boemo ba Setoko: | E teng thepeng e teng ka lebenkeleng |
| Ship From: | Hong Kong |
| Tsela ea ho Romela: | DHL/Fedex/TNT/UPS/EMS |

| Mofuta | Tlhaloso |
|---|---|
| Letoto la lihlooho tse | - |
| Sephutheloana | Tube |
| Boemo ba Karolo | Active |
| Mofuta oa FET | 2 N Channel (Phase Leg) |
| Karolo ea FET | Silicon Carbide (SiC) |
| Tlatsoa ho Voltage ea Mohloli (Vdss) | 700V |
| Hona joale - Continuous Drain (Id) @ 25 ° C | 124A (Tc) |
| Lits'oants'o (Max) @ Id, Vgs | 19mOhm @ 40A, 20V |
| Vgs (th) (Max) @ Id | 2.4V @ 4mA |
| Tefiso ea Gate (Qg) (Max) @ Vgs | 215nC @ 20V |
| Input Capacitance (Ciss) (Max) @ Vds | 4500pF @ 700V |
| Matla - Max | 365W (Tc) |
| Mocheso o sebetsang | -40°C ~ 175°C (TJ) |
| Ntseng bo eketseha Type | Chassis Mount |
| Sephutheloana / Lebokose | Module |
| Sephutheloana sa Sesebelisoa sa thepa | SP3F |
Boemo ba Setoko: 18
Bonyane: 1
| Bongata | Theko ea thepa ka 'ngoe | Ext. Theko |
|---|---|---|
Theko ha e fumanehe, ka kopo RFQ |
||
US $40 ka FedEx.
Fihla ka mor'a matsatsi a 3-5
Express:(FEDEX, UPS, DHL, TNT)Ho romelloa mahala mahala ho 0.5kg ea pele bakeng sa liodara tse fetang 150$, boima bo feteletseng bo tla lefisoa ka thoko.