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Sehlopha sa Lihlahisoa
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Lihokelo, Lihokelo
- Lihokelo tsa Backplane - ARINC Insets
- Lihokelo tse ka morao - ARINC
- Lihokelo tsa Backplane - Lisebelisoa
- Lihokelo tsa Moralo - Mabitso
- Lihokelo tsa sefofane se ka morao - DIN 41612
- Lihokelo tsa Backplane - Hard Metric, Standard
- Lihokelo tsa Backplane - Matlo
- Lihokelo tsa Backplane - Tse khethehileng
- Banana le Tip Connectors - Lisebelisoa
- Lihokelo tsa Banana le Keletso - Li-adapter
- Banana le Tip Connectors - Tlamang Posts
- Banana le Tip Connectors - Jacks, plugs
- Moqomo - Lisebelisoa
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Li-capacitors
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- Li-Capacitors tsa lifilimi
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- Likristale, li-oscillator, li-resonators
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Lipotoloho tse Kopantsoeng (ICs)
- Audio Morero o Khethehileng
- Tshupanako/Nako - Tshebediso e Ikgethileng
- Tshupanako/Nako - Dibafa tshupanako, Bakhanni
- Nako / Nako - Lijenereithara tsa Clock, PLLs, Frequency Synthesizers
- Tshupanako/ Nako - Mela ya ho dieha
- Oache/Nako - Libetri tsa IC
- Tshupanako/Nako - Linako tse lokiselitsoeng le li-oscillator
- Tshupanako / Nako - Lioache tsa Nako ea 'Nete
- Ho Fumana Boitsebiso - ADCs/DACs - Sepheo se Ikgethileng
- Ho Fumana Boitsebiso - Analog Front End (AFE)
- Ho Fumana Boitsebiso - Liphetoho tsa Analog ho isa ho Digital (ADC)
- Ho Fumana Boitsebiso - Digital Potentiometers
- Ho Fumana Boitsebiso - Liphetoho tsa Digital ho ea ho Analog (DAC)
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Likopano tsa Cable
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Liphetoho
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Tšireletso ea Potoloho
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Lihlahisoa tsa Discrete Semiconductor
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Optoelectronics
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Fans, Thermal Management
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- Thermal - Pholiso ea Mokelikeli, Ho futhumatsa
- Thermal - Pads, Sheets
- Thermal - Thermoelectric, Peltier Assemblies
- Thermal - Thermoelectric, Peltier Modules
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Lihokelo, Lihokelo
NXP Semiconductors / SA605D/01,118
Setšoantšo ke sa litšupiso, ka kopo ikopanye le rona ho fumana setšoantšo sa 'nete
SA605D/01,118
| Nomoro ea Karolo ea Moetsi: | SA605D/01,118 |
| Moetsi: | NXP Semiconductors |
| Karolo ea Tlhaloso: | RF RCVR ASK/FSK 0HZ-500MHZ 20SO |
| Lipampiri tsa boitsebiso: | SA605D/01,118 Lipampiri tsa boitsebiso |
| Keta Boemo ba Mahala / Boemo ba RoHS: | Lead Free / RoHS e tsamaellana |
| Boemo ba Setoko: | E teng thepeng e teng ka lebenkeleng |
| Ship From: | Hong Kong |
| Tsela ea ho Romela: | DHL/Fedex/TNT/UPS/EMS |
- TLHOKOMELO
- NXP Semiconductors SA605D/01,118 e fumaneha ho chipnets.com. Re rekisa Karolo e Ncha le ea Pele feela 'me re fana ka waranti ea selemo se le seng. Haeba u ka rata ho tseba ho eketsehileng ka lihlahisoa kapa ho sebelisa theko e molemo ho feta, ka kopo ikopanye le rona tobetsa Inthaneteng Chat kapa u romelle quote ho rona.
Likarolo tsohle tsa Eelctronics li tla be li paka ka mokhoa o sireletsehileng haholo ka tšireletso ea ESD ea antistatic.
Tlhaloso
| Mofuta | Tlhaloso |
|---|---|
| Letoto la lihlooho tse | SA605 |
| Sephutheloana | Tape & Reel (TR)Cut Tape (CT)Digi-Reel® |
| Boemo ba Karolo | Active |
| Maqhubu | 0Hz ~ 500MHz |
| Ho ba le kutlo | - |
| Sekhahla sa data (Max) | - |
| Ho feto-fetoha ha lentsoe kapa Protocol | ASK, FSK |
| Likopo | FM Remote Receiver |
| Hona joale - Ho amohela | 5.7mA |
| Sebopeho sa data | PCB, Surface Mount |
| Boholo ba Memori | - |
| Sehokedi sa Antenna | PCB, Surface Mount |
| Likaroloana | RSSI Equipped |
| Gagamalo - Phepelo | 4.5V ~ 8V |
| Mocheso o sebetsang | -40°C ~ 85°C |
| Ntseng bo eketseha Type | Surface Mount |
| Sephutheloana / Lebokose | 20-SOIC (0.295", 7.50mm Width) |
| Sephutheloana sa Sesebelisoa sa thepa | 20-SO |
HO REKA MAKHETHA
Boemo ba Setoko: 533
Bonyane: 1
| Bongata | Theko ea thepa ka 'ngoe | Ext. Theko |
|---|---|---|
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Palo ea thepa
US $40 ka FedEx.
Fihla ka mor'a matsatsi a 3-5
Express:(FEDEX, UPS, DHL, TNT)Ho romelloa mahala mahala ho 0.5kg ea pele bakeng sa liodara tse fetang 150$, boima bo feteletseng bo tla lefisoa ka thoko.
Mehlala e Tloaelehileng
 |
Rochester Electronics |
 |
NXP Semiconductors |
 |
Rochester Electronics |
 |
NXP Semiconductors |
E kentsoe kariking!
Ntho ena e kentsoe kariking ea hau.