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Sehlopha sa Lihlahisoa
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Lihokelo, Lihokelo
- Lihokelo tsa Backplane - ARINC Insets
- Lihokelo tse ka morao - ARINC
- Lihokelo tsa Backplane - Lisebelisoa
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- Lihokelo tsa sefofane se ka morao - DIN 41612
- Lihokelo tsa Backplane - Hard Metric, Standard
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- Lihokelo tsa Backplane - Tse khethehileng
- Banana le Tip Connectors - Lisebelisoa
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Li-capacitors
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Lipotoloho tse Kopantsoeng (ICs)
- Audio Morero o Khethehileng
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Likopano tsa Cable
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Liphetoho
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Tšireletso ea Potoloho
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Optoelectronics
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Fans, Thermal Management
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- Thermal - Pads, Sheets
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- Thermal - Thermoelectric, Peltier Modules
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Lihokelo, Lihokelo
Everspin Technologies, Inc. / EMD4E001G16G2-150CAS2
Setšoantšo ke sa litšupiso, ka kopo ikopanye le rona ho fumana setšoantšo sa 'nete
EMD4E001G16G2-150CAS2
| Nomoro ea Karolo ea Moetsi: | EMD4E001G16G2-150CAS2 |
| Moetsi: | Everspin Technologies, Inc. |
| Karolo ea Tlhaloso: | IC RAM 1GBIT PAR 667MHZ 96BGA |
| Lipampiri tsa boitsebiso: | EMD4E001G16G2-150CAS2 Lipampiri tsa boitsebiso |
| Keta Boemo ba Mahala / Boemo ba RoHS: | Lead Free / RoHS e tsamaellana |
| Boemo ba Setoko: | E teng thepeng e teng ka lebenkeleng |
| Ship From: | Hong Kong |
| Tsela ea ho Romela: | DHL/Fedex/TNT/UPS/EMS |
- TLHOKOMELO
- Everspin Technologies, Inc. EMD4E001G16G2-150CAS2 e fumaneha ho chipnets.com. Re rekisa Karolo e Ncha le ea Pele feela 'me re fana ka waranti ea selemo se le seng. Haeba u ka rata ho tseba ho eketsehileng ka lihlahisoa kapa ho sebelisa theko e molemo ho feta, ka kopo ikopanye le rona tobetsa Inthaneteng Chat kapa u romelle quote ho rona.
Likarolo tsohle tsa Eelctronics li tla be li paka ka mokhoa o sireletsehileng haholo ka tšireletso ea ESD ea antistatic.
Tlhaloso
| Mofuta | Tlhaloso |
|---|---|
| Letoto la lihlooho tse | - |
| Sephutheloana | Tray |
| Boemo ba Karolo | Active |
| Mofuta oa Khopolo | RAM |
| Theknoloji | MRAM (Magnetoresistive RAM) |
| Boholo ba Memori | 1Gb (64M x 16) |
| Sesebelisoa sa Memori | Parallel |
| Kakaretso ea Clock | 667 MHz |
| Ngola Nako ea Nako - Lentsoe, Leqephe | 15ns |
| Nako ea ho Fumana | 18 ns |
| Gagamalo - Phepelo | 1.14V ~ 1.26V |
| Mocheso o sebetsang | 0°C ~ 85°C (TC) |
| Ntseng bo eketseha Type | Surface Mount |
| Sephutheloana / Lebokose | 96-TFBGA |
| Sephutheloana sa Sesebelisoa sa thepa | 96-BGA (10x13) |
HO REKA MAKHETHA
Boemo ba Setoko: 34
Bonyane: 1
| Bongata | Theko ea thepa ka 'ngoe | Ext. Theko |
|---|---|---|
Theko ha e fumanehe, ka kopo RFQ |
||
Palo ea thepa
US $40 ka FedEx.
Fihla ka mor'a matsatsi a 3-5
Express:(FEDEX, UPS, DHL, TNT)Ho romelloa mahala mahala ho 0.5kg ea pele bakeng sa liodara tse fetang 150$, boima bo feteletseng bo tla lefisoa ka thoko.
Mehlala e Tloaelehileng
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Everspin Technologies, Inc. |
E kentsoe kariking!
Ntho ena e kentsoe kariking ea hau.