Setšoantšo ke sa litšupiso, ka kopo ikopanye le rona ho fumana setšoantšo sa 'nete
| Nomoro ea Karolo ea Moetsi: | XCZU17EG-2FFVD1760I |
| Moetsi: | Xilinx |
| Karolo ea Tlhaloso: | IC SOC CORTEX-A53 1760FCBGA |
| Lipampiri tsa boitsebiso: | XCZU17EG-2FFVD1760I Lipampiri tsa boitsebiso |
| Keta Boemo ba Mahala / Boemo ba RoHS: | Lead Free / RoHS e tsamaellana |
| Boemo ba Setoko: | E teng thepeng e teng ka lebenkeleng |
| Ship From: | Hong Kong |
| Tsela ea ho Romela: | DHL/Fedex/TNT/UPS/EMS |

| Mofuta | Tlhaloso |
|---|---|
| Letoto la lihlooho tse | Zynq® UltraScale+™ MPSoC EG |
| Sephutheloana | Tray |
| Boemo ba Karolo | Active |
| Mekhoa ea ho haha | MCU, FPGA |
| Sesebelisoa sa Core | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
| Boholo ba Flash | - |
| Boholo ba RAM | 256KB |
| Lisebelisoa | DMA, WDT |
| Khokahano | CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Lebelo | 533MHz, 600MHz, 1.3GHz |
| Litšobotsi tsa Mathomo | Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
| Mocheso o sebetsang | -40°C ~ 100°C (TJ) |
| Sephutheloana / Lebokose | 1760-BBGA, FCBGA |
| Sephutheloana sa Sesebelisoa sa thepa | 1760-FCBGA (42.5x42.5) |
Boemo ba Setoko: Same Day Shipping
Bonyane: 1
| Bongata | Theko ea thepa ka 'ngoe | Ext. Theko |
|---|---|---|
Theko ha e fumanehe, ka kopo RFQ |
||
US $40 ka FedEx.
Fihla ka mor'a matsatsi a 3-5
Express:(FEDEX, UPS, DHL, TNT)Ho romelloa mahala mahala ho 0.5kg ea pele bakeng sa liodara tse fetang 150$, boima bo feteletseng bo tla lefisoa ka thoko.